Micro Ball Inspection Repair System for Substrates BM-2150SR
Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.
A microball inspection and repair system capable of handling a wide range of sizes, from strip substrates to large panels. It also supports simultaneous inspection of two types of differently sized balls, assisting in achieving high implementation quality. 【Features】 ■ High-speed inspection of ball missing, excess balls, and pitch using an inspection camera (150Mx1) Supports inspection of two types of differently sized balls ■ Two types of repair support ・(a) Ball missing: Ball placement after applying flux ・(b) Excess balls: Removal by nozzle suction ■ An image processing system that follows the expansion of the C4 area due to the increase in package size ■ Compatible with SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.
- Company：日精 本社
- Price：Other
